Hexafluorobisphenol A CAS#1478-61-1
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Chemical Name:Hexafluorobisphenol A
CAS No.:1478-61-1
Molecular Formula:C15H10F6O2
Molecular weight:336.23
Sample: Available
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Products Description of Hexafluorobisphenol A CAS#1478-61-1
Bisphenol AF is also known as hexafluorobisphenol A, 2,2-bis(4-hydroxyphenyl)hexafluoropropane, 2,2-bis(4-hydroxyphenyl)hexafluoropropane, etc., referred to as BPAF. It is slightly soluble in carbon tetrachloride, difficult to dissolve in water, and easily soluble in organic solvents such as ethanol, acetone, ether, toluene, and strong alkaline solutions. Bisphenol AF can decompose and burn when heated to 510°C.
Hexafluorobisphenol A Chemical Properties
Melting point | 160-163 °C(lit.) |
Boiling point | 400°C |
density | 1.3837 (estimate) |
vapor pressure | 0Pa at 20℃ |
Fp | >100°C |
storage temp. | Inert atmosphere,Room Temperature |
solubility | |
pka | 8.74±0.10(Predicted) |
color | White to Pale Beige |
Water Solubility | Insoluble in water. |
BRN | 1891568 |
InChIKey | ZFVMWEVVKGLCIJ-UHFFFAOYSA-N |
LogP | 2.79 at 20℃ |
CAS DataBase Reference | 1478-61-1(CAS DataBase Reference) |
EPA Substance Registry System | Phenol, 4,4'-[2,2,2-trifluoro-1-(trifluoromethyl)ethylidene]bis- (1478-61-1) |
Safety Information
Hazard Codes | Xi |
Risk Statements | 36/37/38 |
Safety Statements | 26-36-37/39 |
WGK Germany | 2 |
RTECS | SN2780000 |
Hazard Note | Corrosive |
TSCA | Yes |
HS Code | 29081990 |
Hazardous Substances Data | 1478-61-1(Hazardous Substances Data) |
Product Application of Hexafluorobisphenol A CAS#1478-61-1
Bisphenol AF is mainly used as a vulcanizing agent (crosslinking agent) for fluororubber, and more than 70% of fluororubber adopts bisphenol AF vulcanization system. Bisphenol AF can be used as a monomer to synthesize fluorinated polyamides, fluorinated polyesters, fluorinated polyarylethers, fluorinated polyetherketones, fluorinated polycarbonates, fluorinated epoxy resins, fluorinated polyurethanes and other fluorinated polymers,
used as gas separation membranes, proton exchange membranes, dielectric coatings, optical fiber sheaths, photoelectric tube substrates, adhesives, etc., and is widely used in microelectronics, fuel cells, optics, space technology and other fields.
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